Abstract

The microencapsulation technique addresses the concerns of phase change material (PCM) leakage, transportation challenges, and limited efficacy in thermal energy management applications. Nevertheless, the organic shell material has lower thermal conductivity, and significant leakage issues. To improve the ability of heat transfer as well as leakage prevention, a novel form of microencapsulated phase change material (MEPCM) with paraffin core, and melamine formaldehyde (MF) shell modified by hybrid magnesium oxide (MgO), and graphene oxide (GO) thermal conductivity enhancer (TCE) interface is fabricated through the process of in-situ polymerization. The results revealed a well-developed TCE interface layer in between the core, and the shell of the modified spherical microcapsules. The modified MEPCMs exhibited a maximum encapsulation rate of 88.0 %, and 177.84 J/g latent heat of melting. The thermal stability of the MEPCMs is increased by 50 °C to 70 °C, and the thermal conductivity is remarkably elevated to 0.44 W/mK. The leakage rate is significantly reduced by 98.58%. The excellent thermal energy storage/release performance of the modified MEPCMs is attributed to the TCE interface, which serves as an efficient medium for thermal conduction. The modified MEPCMs endure exceptional physical, and thermo-chemical properties, that are relevant for thermal energy management applications.

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