Abstract
The application of advanced polycondensed fused polynuclear aromatic (COPNA) resin to a material for flexible printed wiring boards was studied in this work. To give flexibility to the advanced COPNA resin, a polymer blend technology was introduced. Nylon 6 was selected from the nominated blend polymers with advanced COPNA resin because of sufficient compatibility between the advanced COPNA resin and the amino groups. The polymer blend film, consisting of advanced COPNA resin and nylon 6 prepared at a blend fraction of 50/50 (COPNA/nylon 6), exhibited sufficient flexibility for printed wiring boards, and exhibited attractive properties of T g at 158°C and a dielectric constant at 3.6. Morphological analysis was also carried out by transmission electron microscopy to the blends. Phase-separated structures were observed in entire systems of fully cured films because of crystallinity of the nylon 6, but sufficient compatibility for practical uses was observed in both the 30/70 and 50/50 systems. The compatibility became poor with an increase of the advanced COPNA resin fraction.
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