Abstract
We develop wire saws with the diamond grains bonded to the wires for non-slurry cutting process. We invented a special product machine which has a high vacuum furnace and a special solder that contain a metallic compound. In this paper we demonstrate the finest saw wire that is 50 µm of diameter tungsten (W) wires and can perform in cutting an extremely hard material which include the diamond substrate.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.