Abstract
The paper presents the results of the development of conditions for the production of elastic polishing materials based on solutions of polyethyruretanes, for the chemical-mechanical planarization of semiconductor silicon wafers.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
