Abstract
This paper describes the ongoing research and development at Amkor Technology of Chip-on-chip/Face to Face (CoC/F2F) technology being developed in parallel with Through Silicon Via (TSV) package assembly. Unlike other 3D packaging techniques using TSVs that require front end processing, CoC/F2F technology uses existing chip attach (C/A) or thermal compression (TC) equipment to connect each die - referred to as the mother die and daughter die for the larger and smaller ICs, respectively. The cost to assemble CoC/F2F is relatively inexpensive, making it an attractive alternative to TSV for many applications. Some of these include the integration of ASIC with logic, MEMS with ASIC, microcontroller with memory, and optoelectronic module with microcontroller.
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