Abstract
A biaxially stretched film of BEK, a new engineering plastic with high heat resistance (T g: 181° C, T m: 364° C) and chemical resistance, was developed as a base film for flexible printed circuit boards. Its heat shrinkage percentage at 260° C and the coefficient of thermal expansion below T g were decreased to below 0.1%, and 3.3×10-5/° C, respectively. The process of determining stretching and heat setting conditions for film formation with a role stretcher and a tenter is reported.
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