Abstract
In the semiconductor inspection, number of pads at unit area is increasing and pad array have become irregular 2-dimensional. So we develop a bellows type micro contact probe. Our micro contact probe is a vertical-type micro contact probe for area arrays and narrow pitch electrode pads. We choose bellows type micro contact probe to prevent stress concentration. Our design targets are 120 um pad pitch, 20-50 um OD(over drive) and over 5 mN reaction force. In this research, micro contact probe is made by electroplating(Ni-Co). structural analysis is accomplished by FEM. And characterization of micro contact probe is done by our own mechanical tester. So material property is measured for structural analysis and structural analysis result will be compared with experimental result.
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