Abstract
Due to the increasingly thin, chip, miniaturized and high-precision electronic components, the samples in many links of the production and testing process of components are scattered and disordered. Meanwhile, the low efficiency of manual testing and the instability of detection accuracy make the intelligent material discharging detection of components extremely urgent. In this paper, intelligent requirements for detection are comprehensively analyzed, and technologies such as machine vision imaging optimization, deep learning feature matching, and tiny sample grasping and placement are deeply studied. An automatic discharging system integrating counting module, defect detection module and automatic discharging module is developed to realize intelligent discharging detection of tiny bulk disordered devices.
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