Abstract
Information processing devices require thin and brittle substrates with surface flatness in the order of 0.1 μm per 200 × 200 mm. To realize such ultra-flatness, we designed, fabricated, and evaluated an “intelligent face grinding machine”. The machine is a vertical spindle face grinding machine which we newly constructed to have higher rigidity and thermal insensitiveness for passive reduction in tool positioning error. In addition, an active knowledge-based control system with sensors, computers and actuators further reduces the deviation. We verified that the machine produces flatness of 0.5 μm per 200 × 200 mm on ceramic, glass and silicon substrates.
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