Development of an Embedded High-Temperature Field Measuring Instrument

Abstract

This paper describes the development of an embedded high-temperature measuring instrument, which is composed of lens, photoelectric converter based on area-array CCD, and data acquisition, processing, Ethernet communication module based on DSP. The device is a creation of imaging spectrum, CCD imaging technology, digital image processing method and Ethernet communication together effectively. The advantages of this approach are: First, the networked measuring platform provides the possibility for process parameters optimization. Second, direct digital signal communication improves the anti-interference ability. Third, by employing 4-stage pipeline data processing mechanism greatly improves the real-time requirement. Fourth, through the constitution of application-layer protocol, the reliability of high-speed data transmission via Ethernet is guaranteed. The experiment by blackbody furnace in the laboratory shows that the maximum absolute error is 3.2 ºC, and the maximum relative error is 0.40%.