Abstract
To develop Ag (silver)–In (indium)–Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between Al alloy (Al5083) and the ternary Ag–In–Cd alloy. We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 10 min. for small test pieces ( ϕ22 mm in dia. × 6 mm in height). Hardened layer due to the formation of AlAg 2 was found in the bonding layer, however, the rupture strength of the bonding layer is more than 30 MPa, the calculated design stress. Bonding tests of a large size piece (200 × 200 × 30 mm 3), which simulated the real scale, were also performed according to the results of small size tests. The result also gave good bonding and enough required-mechanical-strength.
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