Abstract
The authors report the development of a monolithic diamond field emission device in lateral configuration operating in a vacuum package. Nanocrystalline diamond is applied in the microfabrication of planar lateral emitter diodes on a silicon-on-insulator substrate. A feasible packaging process has been developed for the device, where the diodes are die attached, wire bonded, and vacuum sealed in a cavity package. Field emission characterization measurements performed on the packaged diamond lateral vacuum devices indicate a practical construct and package for vacuum micro/nanoelectronic applications.
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