Abstract
This study reports a new stacking method for assembling a 3-D microprobe array. To date, 3-D array structures have usually been assembled with vertical spacers, snap fasteners and a supporting platform. Such methods have achieved 3-D structures but suffer from complex assembly steps, vertical interconnection for 3-D signal transmission, low structure strength and large implantable opening. By applying the proposed stacking method, the previous techniques could be replaced by 2-D wire bonding. In this way, supporting platforms with slots and vertical spacers were no longer needed. Furthermore, ASIC chips can be substituted for the spacers in the stacked arrays to achieve system integration, design flexibility and volume usage efficiency. To avoid overflow of the adhesive fluid during assembly, an anti-overflow design which made use of capillary action force was applied in the stacking method as well. Moreover, presented stacking procedure consumes only 35 minutes in average for a 4 × 4 3-D microprobe array without requiring other specially made assembly tools. To summarize, the advantages of the proposed stacking method for 3-D array assembly include simplified assembly process, high structure strength, smaller opening area and integration ability with active circuits. This stacking assembly technique allows an alternative method to create 3-D structures from planar components.
Highlights
IntroductionAdvance micromachined/assembled micro probe arrays with electrical stimulation/recording ability have come to play an essential role in exploring central neural systems
In recent years, advance micromachined/assembled micro probe arrays with electrical stimulation/recording ability have come to play an essential role in exploring central neural systems.Simultaneous observation of a larger number of cell activities has become the general requirement to understand the nervous system [1]
In the proposed stacking method, the system integration will not increase the opening area because it can be accomplished by replacing spacers with ASIC chips
Summary
Advance micromachined/assembled micro probe arrays with electrical stimulation/recording ability have come to play an essential role in exploring central neural systems. Simultaneous observation of a larger number of cell activities has become the general requirement to understand the nervous system [1]. Advances in neuroscience and neuroprosthetics require microelectrode arrays that are able to access numerous neurons simultaneously with high spatial resolution [2]. Recording of the extracellular action potentials has been accomplished by surgically implanting neural probes into the target neurons of interest, which resulted from neural activities [3]. Probes that could insert a large number of recording sites into neural tissues with minimal tissue damage are needed. The design of the probe arrays should be optimized for an experimental purpose that an electrode diameter of a few micrometers could support single-unit recording [4]
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