Abstract
Thermoelectric energy generator (TEG) is a device which is used to convert temperature difference between the hot and cold junctions into electrical energy. This paper aims at developing a TEG chip of small layout 5 mm2 having three 2.01 mm $\times0.72$ mm cells in a total of 10 080 thermocouples by semiconductor foundry service (TSMC) for the advantages in batch production, low cost, and scalability. The design has the unique features to improve TEG performance by having (1) thin-film polycrystalline silicon-germanium Si0.9Ge0.1 layer for higher thermoelectric conversion efficiency, (2) isolation cavity for better thermal insulation, and (3) structural support for improved thermocouple dimensional stability. It is shown that the TEG chip can deliver power factor $0.125~\mu $ W/cm2K2 and voltage factor 25.91 V/cm2 K. The experimental verification demonstrates that the 5 mm2 chip has output power $2.083~\mu $ W and voltage 3.4 V at 20 K temperature gradient. This is by far the TEG design with best thermoelectric performance implemented by the semiconductor foundry service.
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