Abstract
The double-layer blanket (DLB) reverse offset is a newly designed printing process for patterning electronic circuits on a 3D curved surface. Unlike the existing reverse offset process, the DLB reverse offset utilizes an offset roll composed of two layers comprising polydimethylsiloxane (PDMS) and a thick, soft cushioned rubber to print microelectrode patterns and transparent electrodes on a curved surface. The optimal printing process was determined by adjusting the printing pressure and printing speed for horizontal and vertical micropatterns, based on which transparent electrodes with metal mesh and honeycomb structures with a line width of 30 μm and pitch of 600 μm with micropatterns ranging from 30 μm to 60 μm were printed on a curved surface. Ag ink was used, and the 3D curved surface indicated a print quality similar to that of the flat surface for both the vertical and horizontal patterns and transparent electrodes. The DLB reverse offset technique demonstrated the possibility of printing on a 3D curved surface and is expected to broaden the range of printed electronics to applications such as smart glasses and 3D shape sensors.
Highlights
Printed electronics involves the utilization of graphic printing technology and conductive, semiconducting, and dielectric material technology to create electronic devices and products
The results confirmed that utilizing the double-layer blanket (DLB) reverse offset produced no substantial difference in line widths between the micropatterns printed on the 3D curved surface and those printed on the flat surface, and that the transmittance and sheet resistance of the transparent electrodes printed by a similar process achieved a sufficiently high performance for use as a transparent electrode
The DLB roll comprised a soft cushioned rubber wrapped around a metal cylinder and a blanket sheet that comprised PET and PDMS wrapped around the rubber, which was used to examine the printing process
Summary
Printed electronics involves the utilization of graphic printing technology and conductive, semiconducting, and dielectric material technology to create electronic devices and products. Printed electronics is an eco-friendly additive manufacturing process that can realize micropatterns and thin-film coatings, involves fewer steps than the existing photolithography technology, and is capable of continuous processing. To form electronic devices or circuits such as touch screen panels (TSPs) or photovoltaics (PVs) on curved surfaces, it is necessary to print transparent electrodes [26] with micropatterns connected by conductive lines; in this study, a novel printer and process for fabricating 3D electronic devices are based on the reverse offset process. To print an electronic circuit on the surface of a 3D curved substrate, a double-layer blanket (DLB) roll was manufactured using very soft and cushioned rubber and PDMS, based on which a study was conducted to optimize the DLB reverse offset printing process.
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