Abstract
A novel advanced spray technology, in which droplet size and velocity are accurately and tightly controlled, has been developed to realize the damage-free cleaning for next generation device manufacturing. The influence of droplet characteristics on pattern collapse/damage was quantitatively investigated using this technology. It was shown that the amount of damage was correlated to the droplet energy density on the wafer. The mechanism of pattern damage generated by the conventional dual fluid spray was revealed by the damage threshold curve, which was obtained from the theoretical consideration. Finally higher particle removal efficiency without any pattern damage was achieved by controlling the distribution of effective droplets for cleaning.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
