Abstract
In this paper, the mechanism of Electrolysis In-process Dressing (ELID) lapping process using new BCB (bamboo charcoal bonded) abrasive wheel is researched. Some experiments of machining for silicon wafers were carried out for exploring the effect of some machining process parameters on material removal rate and surface roughness. Experiments show that: Material removal rate and machined workpiece surface roughness are increased with increase of the lapping wheel’s rotation speed and processing loading; The machined workpiece surface quality is affected with the lapping wheel surface condition, due to the abrasives are trued by electrolysis dressing in the lapping process, therefore the BCB lapping wheel always keeps better machining condition to obtain excellent machined workpiece surface quality efficiently.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
