Development of a New BCB ELID Lapping Process

Abstract

In this paper, the mechanism of Electrolysis In-process Dressing (ELID) lapping process using new BCB (bamboo charcoal bonded) abrasive wheel is researched. Some experiments of machining for silicon wafers were carried out for exploring the effect of some machining process parameters on material removal rate and surface roughness. Experiments show that: Material removal rate and machined workpiece surface roughness are increased with increase of the lapping wheel’s rotation speed and processing loading; The machined workpiece surface quality is affected with the lapping wheel surface condition, due to the abrasives are trued by electrolysis dressing in the lapping process, therefore the BCB lapping wheel always keeps better machining condition to obtain excellent machined workpiece surface quality efficiently.