Abstract
High-density interconnect printed-circuit boards and substrates are widely used for high-end electronics to meet the demand for greater input/output density and a smaller footprint area. Microvias as electrical interconnections between circuit layers have a much smaller scale (no larger than 150 ${\mu }\text{m}$ in diameter) compared to conventional plated-through holes, and require a different fabrication process that introduces unique reliability challenges. This paper identifies factors that affect microvia fatigue life and presents a design of experiments to quantify the effects of those factors on microvia life in terms of cycles to failure. A regression life prediction model is formulated to account for the significant design, material, and defect parameters.
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