Development of a high density pixel multichip module at Fermilab

Abstract

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The backs of the ICs are in thermal contact with the supporting structure, while the tops are flip-chip bump bonded to a pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bonded to the circuit. The BTeV pixel detector is based on a design relying on this hybrid approach. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance characteristics of the pixel module prototypes.