Development of 200mm SiC Technology - Epitaxial Thickness Uniformity Observation on Different 8 Inch 4H-SiC Substrates

Abstract

The enlargement of 4H-SiC seed size from 150 mm (6 inch) to 200 mm (8 inch) is currently underway and 8 inches SiC substrate is now facing the market to switch the actual 6-inch technology to 8-inch technology. The aim of this work is to evaluate the influence on the epitaxial layer (using an epi growth campaign made of 21 consecutive runs) using substrates coming from different vendors (3 different suppliers adopted). The same epitaxial process and same reactor were adopted to grow all the samples. After the growth campaign, a difference of thickness uniformity between the three substrate suppliers was observed while no difference of doping uniformity was detected.