Abstract
Existing studies rarely focus on manufacturing complex diamond tools via fused filament fabrication subject to the development of corresponding filaments. This work aims to develop diamond-containing metal composites filament to effectively fabricate ultrathin diamond blade. In this study, properties of filaments with different volumes of diamond and surface modifier were characterized and evaluated. The interface adhesion between the diamond particles and the binder matrix was enhanced with the surface modifier, thereby reducing the internal defects and improving the diamond distribution uniformity. Flexibility and tensile strength of the filaments could be greatly enhanced as the improved interfacial adhesion. Besides, the enhanced viscosity of the feedstock contributed to a closer adhesion between the deposited strands. Finally, ultrathin diamond blade with a sintered density of 95.2 % could be achieved with the optimized filament. The results demonstrate the ability of the optimized filament to fabricate diamond tool via fused filament fabrication. • Diamond-containing metal matrix composite filaments were successfully fabricated. • Diamond content are highly relevant to the quality of the filaments. • Surface modifier improved the interface adhesion between diamond and binder matrix. • Interface adhesion status influences mechanical properties and viscosity of filaments. • Blade with a sintered density and thickness of 95.2 % and 0.33 mm can be achieved.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.