Abstract
In recent years, lead-free has been promoted by the RoHS Directive which bans the use of lead in electronic devices, and nano Ag die attach pastes has attracted attentions. Nano Ag particles show high electrical and thermal conductivity, but generally require Au or Ag plating on the surface of the substrate. Therefore, demands for Cu substrate without the plating are also increasing to reduce costs. This paper deals with the fundamental study on nano Ag pastes newly developed with a unique approach. The technology provides a low-temperature sintering capability without pressure during cure process. In addition, resin reinforcing technology and lowering modulus technology have been developed to improve the mechanical properties. By adding epoxy resins, the porous area is filled with the resin and the sintered structure is reinforced. Additionally, the reliability can be more improved by thermoplastic resin particles. To meet the demand for the applications without Ag or Au plating, nano Ag pastes for bare Cu substrate have newly been developed. By using several types of Cu substrates without plating, surface analysis and bonding properties of the pastes were investigated in this study.
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