Abstract
Operating devices at higher temperatures in automotive applications and the use of wide bandgap materials have driven the development of new bonding technologies as silver sintering and transient liquid phase bonding (TLPB). Considering their specific demands a dedicated tool for processing in batch was developed and characterized. Press unit containing a flexible elastomer membrane was implemented in a vacuum reflow soldering chamber. It allows bonding of various devices with different thickness without using height compensating tooling. Pressures up to 0.5 MPa, temperatures of maximum 300 °C and reducing atmosphere were utilized to demonstrate the process capability for void free low pressure silver sintering and Cu-Sn TLPB.
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