Development and characterization of embedded thin-film capacitors for mixed signal applications on fully organic system-on-package technology

Abstract

As part of the system on package (SOP) concept being developed at the Packaging Research Center (PRC), Georgia Institute of Technology, a test vehicle to demonstrate the suppression of simultaneous switching noise (SSN) using embedded decoupling capacitors with polymer-ceramic composites as the dielectric was implemented. Similarly, the test vehicle was used for the characterization of the dielectric to demonstrate its feasibility in RF applications. One of the key factors for the integration of future systems is the incorporation of functionality into the substrate by using low cost, low temperature (<150/spl deg/C) sequential build-up processes. In order for embedded decoupling capacitors to be effective in mixed signal systems, the material properties of the dielectric must be well characterized. For the decoupling and RF capacitor, the capacitance and the self-resonant frequency values are critical properties. Also, the impact and importance of varying dielectric thickness on a large area was studied. The capacitors developed and characterized here compare well to some commercially available surface mount components; furthermore, this work represents the first demonstration of a single embedded capacitor technology for both low to mid-frequency decoupling and RF applications on a large area fully organic substrate. This study will have significant impact on high-end mixed signal systems.