Development and Characterization of Bismaleimides Containing Aliphatic Chain for Microelectronics Application

Abstract

AbstractA series of bismaleimide systems containing aliphatic backbone chain have been synthesized and investigated. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical analysis (TMA), rheometry and tensile test were used to characterize the thermal and mechanical properties. It was noted that backbone chain length and odd-even effect affected properties. As the chain length increases, the curing peak temperature, gel temperature of BMI all increase, but the melting point, glass transition and moisture absorption decrease. The melting points of BMI-3,5,7 reduced most significantly. The tensile properties were affected by odd even effect significantly. BMI-3,5,7 with odd number of carbons have less stress and strain than those of even ones.