Development and Characterisation of New Biocompatible Sn-Mg Lead-Free Solder

Abstract

This work is focused on a development and research of a new lead-free Sn-Mg solder, alloy compatible with the human body. Tin and magnesium are biocompatible elements which do not cause an inflammation or allergic reactions with living tissues. We have prepared the Sn97Mg3 solder (wt. %) by a rapid solidification of its melt on a copper wheel (melt-spinning technique). This solder may find applications in electronic devices for intracorporeal utilisation. The microstructure of the prepared solder exhibits a heterogeneous distribution of the SnMg2 intermetallic particles within the β-Sn matrix. Structure of the solder was studied by an in-situ high energy X-ray diffraction experiment (energy of an X-ray photon: 60 keV) where 2D XRD patterns were collected from the sample in the temperature range from 298 K to 566 K. The experiment was performed at a high brilliance 3rd generation synchrotron source of radiation (PETRA III storage ring, DESY, Hamburg, Germany) at the P02 undulator beamline. From the measured X-ray diffraction data by applying the Rietveld refinement technique we have obtained thermal volume expansion data, mean positions of atoms as well as isotropic atomic displacement parameters of the constituent SnMg2 and the β-Sn crystalline phases. Thermal behaviour was studied by differential scanning calorimetry at heating rates of 5, 15, 30 and 60 K.min-1 and compared with the measured X-ray data. Our main goal lies in a preparation of a lead-free solder with fine grain structure made exclusively of biocompatible elements. We demonstrated that the rapid melt solidification technique leads to in an improvement and better thermal stability of this alloy.