Developing Diffusion Bonding Windows for Joining Powder Metallurgically Produced Pure Aluminium and Pure Copper

Abstract

In this investigation, pure aluminium (Al) and pure copper plates manufactured by powder metallurgy (P/M) technique were bonded by diffusion bonding. Joining of these materials by fusion welding is difficult because of the formation oxide films and brittle intermetallic compounds in the bond region which affect the quality of bonds. However, diffusion bonding is a suitable process to join these materials without much difficulties. In this investigation, an attempt was made to develop the diffusion bonding windows to join pure Al with pure Cu plates produced by P/M technique using different combinations of process parameters such as bonding temperature, bonding pressure and holding time The quality of bonds was checked by the microstructure analysis. Diffusion bonding windows (DBW) presented in this paper will act as reference maps for selecting appropriate process parameters to join pure Al with pure Cu plates fabricated by P/M technique.