Abstract
Abstract The global electronics industry has faced pressure from diversity standards and regulations such as RoHS, WEEE, and REACH, among others. Therefore, electronics firms are striving to implement the triple bottom line (TBL) in their real practices to attain the co-benefits for stakeholders. However, to assess the firms’ performance, there is a lack of a hierarchical structure to consider the interrelationships among these co-benefits. Hence, the objective of this study is to develop a precise TBL structure to assist firms in identifying the key practices to attain the co-benefits. There are three notable results: 1. there are nine aspects of the hierarchical structure, in contrast to the original TBL framework; 2. the hierarchical structure offers precise guidelines for firm practices; and 3. the proposed hybrid method is employed to address the co-benefits the industry seeks to attain. This study provides a theoretical basis for enhancing the understanding of co-benefits and identifies a precise way to guide firms to achieve the co-benefits of the TBL.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.