Abstract
To address the necessity for a predictive computational tool for layout design in cracklithography, a tool for nanowire fabrication, a computational study is carried out usingfinite element analysis, where crack-free edge and crack–crack interactions are studied forvarious material combinations. While the first scenario addresses the ability toinduce a controlled curvature in a nanowire, the latter provides an estimationof the minimum distance which can be kept between two straight nanowires.The computational study is accompanied by an experimental demonstration onSi/SiO2 multilayers. Finite element results are found to be well aligned with experimentalobservations and theoretical predictions. Stronger interaction is evident with a curved crackfront modeling as well as with increasing first and decreasing second Dundurs’parameters. Therefore cracks can be packed closer with decreasing film stiffness.
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