Abstract
T-stress plays an important role in the fracture of various materials, and is frequently adopted as a second fracture parameter in addition to the stress intensity factor. In this paper, the T-stresses for cracks in both homogeneous and functionally graded materials under thermal loadings are computed by the numerical manifold method (NMM), which is very suitable for crack modeling due to the use of bi-cover systems. After the calculation of temperature and displacement fields by the NMM solver, the T-stress is extracted through the domain-independent interaction integral. The proposed method is verified through two benchmark problems and then applied to study three more complex cases where the effects of material parameters and crack configurations on the T-stress are further examined.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
