Abstract

The non-contact and non-destructive photothermal beam deflection (PBD) method has been used for the characterization of the thermal properties of Alumina (Al2O3), Mullite (3Al2O3·2SiO2) and Oxidic-Bonded Silicon Carbide (OBSiC) samples often used in chemical engineering. Measurements of thermal diffusivity κ have been performed. One obtains for Alumina, for Mullite and for OBSiC.

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