Determination of thermal conductivities of Sn–Zn lead-free solder alloys with radial heat flow and Bridgman-type apparatus

Abstract

The variations of thermal conductivities of solid phases versus temperature for pure Sn, pure Zn and Sn–9 wt.% Zn, Sn–14 wt.% Zn, Sn–50 wt.% Zn, Sn–80 wt.% Zn binary alloys were measured with a radial heat flow apparatus. The thermal conductivity ratios of liquid phase to solid phase for the pure Sn, pure Zn and eutectic Sn–9 wt.% Zn alloy at their melting temperature are found with a Bridgman-type directional solidification apparatus. Thus, the thermal conductivities of liquid phases for pure Sn, pure Zn and eutectic Sn–9 wt.% Zn binary alloy at their melting temperature were evaluated by using the values of solid phase thermal conductivities and the thermal conductivity ratios of liquid phase to solid phase.