Determination of thermal compact model via evolutionary genetic optimization method

Abstract

Genetic Algorithms (GA) are adaptive search algorithms based on the theory of natural selection and survival of the fittest. In this study, GA was used to derive a thermal compact model of a micro lead frame package. The GA derived model was then used to compute the junction temperature (T/sub j/) of the package for various boundary conditions. The results obtained were checked against simulation results of a detailed thermal model and were found to be within /spl plusmn/1.5% of error. Computational time taken by the detailed finite element model required approximately 4 min whereas the GA derived model took less than 35 s to generate the T/sub j/ of the package. Further, the study shows the feasibility and potential of applying GA as a powerful tool for optimization.