Abstract

Burn-in has been widely used as an effective procedure for screening out failed electronic products during the early-failure period, before shipment to the customers. Environmental stress such as temperature is increasingly being used to effectively shorten the burn-in time, and this method is usually called an accelerated burn-in test. When different stress levels are chosen for the burn-in operation, the burn-in times must be determined. An Arrhenius–Lognormal distribution can describe the lognormal lifetime of electronic products under different temperature levels. In this paper, the Arrhenius–Lognormal distribution and its mean residual life function are applied to the accelerated burn-in cost model, and a genetic algorithm is used to solve for the optimal burn-in time. We choose a real TFT–LCD module as an example, and determine its optimal accelerated burn-in time. A sensitivity analysis of the TFT–LCD module case shows the effect of model parameters on optimal burn-in time.

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