Abstract
We have established a method for assaying the quantities of silicon and copper in aluminium alloys deposited by sputtering on silicon substrates. This method involves the following procedure: 1) The alloy film is peeled away with a metal blade, while taking care not to damage the silicon substrate. 2) The peeled film is dissolved in a hot 1% aqueous solution of sodium hydroxide. 3) The solution is acidified with nitric acid, and the quantities of silicon and copper are assayed by inductively coupled plasma optical emission spectrometry(ICP-OES). We have clarified that this method can assay silicon and copper in as little as 20 mg of peeled aluminium alloy.
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