Abstract

The heat transfer coefficient at the blank-die interface is difficult to determine the values from experiments due to the influence of various factors, such as forming load, coating material, coating thickness, roughness of surfaces and gap formation caused by the deformation of blank and die, etc. In the present paper, the interfacial heat transfer coefficient (IHTC) between the blank and die is identified by using the method of inverse analysis based on measured temperatures. The results show that the method of inverse analysis is a feasible and effective tool for determination of the blank-die IHTC. In addition, it is found that the identified IHTC varies with temperature and load during hot stamping. The characteristics of the IHTC variation have also been discussed.

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