Determination of grain size by XRD profile analysis and TEM counting in nano-structured Cu

Abstract

In this work, a serial of pure copper sample with different grain sizes from nano- to micro-scale were prepared by sparkle plasma sintering (SPS) and following anneal treatment at 873 K and 1073 K, respectively. The grain size distributions of these samples were determined by both X-ray diffraction (XRD) profile analysis and transmission electronic microscope (TEM) micrograph counting. Although these two methods give similar distributions of grain size in the case of as-SPS sample with nano-scale grain size (around 10 nm), there are apparent discrepancies between the grain size distributions of the annealed samples obtained from XRD and TEM, especially for the sample annealed at 1073 K after SPS with micro-scale grain size (around 2 μm), which TEM counting provides much higher values of grain sizes than XRD analysis does. It indicates that for large grain-sized material, XRD analysis lost its validity for determination of grain size. It might be due to some small sized substructures possibly existed in even annealed (large grain-sized) samples, whereas there is no substructures in as-SPS (nanocrystalline) sample. Moreover, it has been found that the effective outer cut-off radius R e derived from XRD analysis coincides with the grain sizes given by TEM counting. The potential relationship between grain size and R e was discussed in the present work. These results might provide some new hints for deeper understanding of the physical meaning of XRD analysis and the parameters derived.