Abstract
Strained-Si/SiGe/Si structures are of increasing importance for microelectronic applications. A fully relaxed-SiGe buffer layer is required for growing strained-Si for applications towards high performance field effect transistors (FETs) having strained-Si as the channel. Preparation of epitaxial strained-Si layers on relaxed-SiGe (001) heterostructures using low pressure chemical vapor deposition (LPCVD) is reported. Gas source molecular beam epitaxy (GSMBE) grown strained-Si films are used to compare with LPCVD strained-Si films. Characterization of the strained-Si layers has been performed using AFM, TEM and Raman spectroscopy. Conduction and valence band offsets of strained-Si on relaxed-SiGe heterostructures have been extracted from measured capacitance–voltage ( C– V) profiling of MOS capacitors fabricated on strained-Si using SiO 2 as the dielectric. Extracted experimental values of the valence and conduction band offsets are in good agreement with theoretical predictions.
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