Abstract
Eddy-current testing (ECT) is a powerful and useful technique for detecting cracks and flaws in uniform conductive plates and pipes. We investigated the diagnostics of printed circuit boards (PCBs) as a new application of ECT. Recent high-density PCBs require a new cost-effective testing system for the production phase. ECT is an interesting approach for inspection of as-made printed wirings, because it uses non-contact testing, low stress, conductive testing, and fast scanning. This paper describes the detection characteristics for some flaws in printed wirings. We experimentally examined the use of ECT for inspecting disconnections, chipping defects, and imperfections in the thickness of printed wirings. The results confirm than the ECT approach is attractive and effective for PCB diagnostics.
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