Abstract
In this work, we demonstrate our approach of automatically detecting star cracks in topography images of structured wafers. In these images, we can identify three-dimensional structures typically originating from replicas of chip structures or from grinding artifacts such as grinding grooves or comets. Yet, also defects such as star cracks have a three-dimensional structure and are therefore visible in those images too. To detect the regions containing star cracks, we develop a pattern recognition algorithm consisting of two cascaded classifiers. With this algorithm, we reach a recall rate of 96.2% and a precision rate of 99.3% of the class star crack, respectively.
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