Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High Reliability

Abstract

How to effectively and accurately evaluate the reliability of the design, structure, material and process of flip-chip packaging devices in mass production has always been a hot topic in the industry. Currently, the destructive physical analysis (DPA) on high-reliability conventional packaging devices worldwide is carried out mainly based on the Methods of Destructive Physical Analysis for Military Electronic Components (GJB4027) or the Destructive Physical Analysis for Electronic, Electromagnetic, and Electromechanical Parts (MIL-STD-1580). However, the structure and process of flip-chip packaging devices are significantly different from those of traditional packaging devices, so traditional evaluation items are unable to effectively evaluate the reliability of flip-chip packaging devices. In this paper, typical ceramic and plastic encapsulated flip-chip packaging devices are chosen for study. The structural feature and the reliability weaknesses of flip-chip packaging devices are identified. Moreover, highly comprehensive DPA methods for flip-chip packaged devices with high applicability and efficiency are proposed by combining the typical failure modes of flip-chip packaging devices, which were verified by the examples. Herein, the reliability of key structural units such as flip-chip covers, bumps, underfill, substrates and solder balls can be effectively assessed by the new DPA method, providing a basis and assistance for revisions of advanced packaging device standards and destructive physical analysis.