Abstract
Conclusions The improved thermal joint can reduce contact resistance at metal-to-metal interfaces by up to a factor of 10. Through proper selection of materials and surface treatment, the joining surfaces may be separated easily after solidification of the low-melting-point alloy. The segmented surface can also provide low thermal resistance during high inertial accelerations. While this technology is being developed to improve thermal control of airborne electronics, it potentially can be applied to many interface heat-transfer problems where low contact resistance and ease of joint disassembly are desired.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
