Abstract

There is a significant deficiency in perovskite solar module (PSM) stability under thermomechanical stressors which is not well-understood. In this perspective, common issues seen with perovskite solar cell device fabrication related to thermomechanical reliability of PSM processing are discussed, with a focus on how the robustness of device layers and interlayer adhesion can be improved. Film stresses, adhesion of charge transport layers, and instability under light and heat are discussed with the purpose of providing insight on designing PSMs for durability. Processing conditions of encapsulation of PSMs and critical parameters to consider are also examined, and accelerated testing protocols for PSMs are discussed that probe mechanical degradation modes and ensure reliability of devices in the field.

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