Designed and Produced the Rotary Substrate Holder and Its Optimized in Angular DC Magnetron Co-Sputtering System

Abstract

We report the design approach of a home-built rotary substrate holder on simple rotation stages for low-pressure vacuum applications. The result of designing and fabricating the rotary substrate holder that it can be successfully used to rotate the substrate in a low-pressure vacuum application without pressure fl uctuations and leakage. Then we investigated the suitable thin fi lm deposition by fabricating optimal multilayer coatings under three variable operating conditions: Speed of substrate, deposition time, and discharge voltage. The thin film deposition result of three copper targets was mounted on each magnetron gun, providing a total of three magnetron guns. The thin fi lm was deposited on a glass slide at room temperature using a custom-built angular DC magnetron co-sputtering system. Analysis of variance for the response surface regression model of film thickness as a function of the three independent variables shows that substrate rotation speed, sputtering time, sputtering voltage, and coeffi cient of squared sputtering time are the most signifi cant factors in determining the optimum film thickness. The optimum thin-film deposition with substrate rotation speed, sputtering time, and sputtering voltage of 10 rpm, 8.61 min, and 200%V, respectively, maximizes the thickness of 72.036 nm.