Abstract
AbstractThis article discusses the application of an in‐mold decoration (IMD) technology for the development of three‐dimensional molded interconnect devices (3D‐MID). The 3D‐MID process uses the film printing technology to print the circuit pattern on a plastic film, and then deform it to the shape of the component by thermoforming. Then, the plastic film is placed inside the mold cavity for injection molding, and is attached to the surface of the component after molding. Experiments were performed for the 3D‐MID process using a semisphere shape. A simple geometric model was also proposed to correlate the printed film patterns before and after the thermoforming. The geometric model will be used to design the required printing pattern on a 2D film for a given 3D pattern on a component.
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