Design of the Microchannels Heat Sink to Augment the Thermal Performance Using Different Type of Cavity with or without Wavy Channel

Abstract

The development of innovative micro sinks design stems from the urge to perform efficient cooling at a cost of low pressure drop for more miniaturized electronic equipment. The three-dimensional investigations have been carried out with disruptive structures in rectangular microchannels. Microchannel heat sinks with triangular cavity, trapezoidal cavity, wavy plane channel, wavy triangular cavity, and wavy trapezoidal cavity have been considered. The performance variations are evaluated based on the average Nusselt number, friction factor, and thermal performance within the range of Reynolds numbers from 141 to 498. The highest thermal performance is achieved by wavy trapezoidal cavity among all channels. The parametric geometrical studies have also been carried out by varying relative geometric parameters such as relative amplitude, relative cavity length, and relative cavity width. The highest heat transfer enhancement equal to 2.33, for the same channel has been achieved with the combination of relative amplitude; relative cavity length and relative cavity width is equal to 0.75, 0.055, and 0.75, respectively at Reynolds number equal to 498. The wavy shapes give better mixing by creating of additional vortices or dean vortices to increase heat transfer with minimum pressure drop.