Abstract
We report on the kinetic inductance detector (KID) array focal plane assembly design for the Terahertz Intensity Mapper (TIM). Each of the 2 arrays consists of 4 wafer-sized dies (quadrants), and the overall assembly must satisfy thermal and mechanical requirements, while maintaining high optical efficiency and a suitable electromagnetic environment for the KIDs. In particular, our design manages to strictly maintain a 50 \(\mu \mathrm {m}\) air gap between the array and the horn block. We have prototyped and are now testing a sub-scale assembly which houses a single quadrant for characterization before integration into the full array. The initial test result shows a >95% yield, indicating a good performance of our TIM detector packaging design.
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