Design of process parameters for the manufacturing of wrapped connections with single solid round wires using the explicit finite element analysis

Abstract

The importance of simulation has grown significantly in recent years and, in addition to its application in product and process planning, it is increasingly used in all planning and implementation phases as well as in the optimization of existing systems. The solderless wrapping process is a highly reliable electrical connection technology. A wrapped connection is a gas-tight, mechanically, and electrically durable pressure connection and often exhibits a lower probability of failure under vibration load compared to soldered connections. Appropriate material selection and correct execution of the wrapping process are prerequisites. In order to achieve these, an exact knowledge of the wire behavior and the design of the process parameters is necessary. In this paper, the wrapping process is simulated using a finite element simulation. In the first step, the relevant parameters are identified by a cause-effect analysis and then integrated into the modeling. The validation of the model is carried out by comparing geometric parameters of the connection and the resulting mechanical stresses of simulation and experiment. The model can be used to simulate a wrapped connection with an accuracy of approximately 95 %. The model is suitable for varying process parameters and investigating their influence on the quality of the connection.