Abstract

Wide bandgap devices enable design of power converters with high power density. However, these power converters require compact printed circuit board (PCB) layouts with low power-loop stray inductance. Consequently, sensing device current in such layouts with minimal intrusion in power-loop remains a challenge. This article presents a PCB coil based current sensor design featuring power-loop stray inductance characterization. The PCB coil is designed on a double pulse test (DPT) board for current sensing of a discrete TO-247 packaged silicon carbide MOSFET. The design utilizes finite element method (FEM) simulations to determine a suitable position for the PCB coil on the DPT board. The coil placement also results in an increased power-loop stray inductance, which is estimated through FEM simulations. Further, these simulations are used for computation of mutual inductance between the PCB coil and the power-loop traces. Depending on this mutual inductance, a voltage is induced across the terminals of the PCB coil, which is then integrated using an op-amp based integrator circuit. Considering practical op-amp limitations, demonstrated with LTspice simulations, various guidelines for sensor design are established in this article. A sensor prototype is developed based on these guidelines, and experimental results from its evaluation are finally presented.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.