Abstract
Abstract High pressure resin transfer molding (HP-RTM) is a widely used method for molding fiber reinforced composites. It uses the fluidity of the resin to infiltrate the fiber material and cure it into a whole. The fiber optic sensors have the characteristics of small size and high sensing accuracy, and are often buried inside the fiber material for in-situ condition monitoring of the resin transfer molding (RTM) process. HP-RTM process requires higher leak tightness, and its molding molds are usually high-precision leak-tight molds with high clamping force on mold edges. In this paper, a fiber optic package process is proposed to prepare an ultra-thin and ultra-high-pressure resistant fiber optic encapsulation element using a composite of two materials, quartz sand and waterborne polyurethane (WPU). The relationship between the optical power and pressure of the fiber optic under this element package was also studied. The experimental results demonstrate that this package structure has excellent compressive strength and can protect the fiber optic from passing directly through the molded contact surface, which improves the application range of fiber optic sensors.
Published Version
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